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| STTH802 Ultrafast recovery diode Main product characteristics IF(AV) VRRM Tj (max) VF (typ) trr (typ) 8A 200 V 175 C 0.8 V 17 ns A K K A A K TO-220FPAC STTH802FP Features and benefits K TO-220AC STTH802D Very low conduction losses Negligible switching losses Low forward and reverse recovery time High junction temperature K A NC DPAK STTH802B K A NC D2PAK STTH802G Description The STTH802 uses ST's new 200 V planar Pt doping technology, and is specially suited for switching mode base drive and transistor circuits. Packaged in TO-220AC, TO-220FPAC, DPAK, and D2PAK this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection. Order codes Part Number STTH802D STTH802FP STTH802B STTH802B-TR STTH802G STTH802G-TR Marking STTH802 STTH802 STTH802 STTH802 STTH802 STTH802 September 2006 Rev 2 www.st.com 1/11 Characteristics STTH802 1 Table 1. Symbol VRRM IF(RMS) IF(AV) Characteristics Absolute ratings (limiting values at Tj = 25 C, unless otherwise specified) Parameter Repetitive peak reverse voltage RMS forward current Average TO-220A, DPAK, D2PAK forward current, = 0.5 TO-220FPAC Surge non repetitive tp = 10 ms Sinusoidal forward current Storage temperature range Maximum operating junction temperature Tc = 145 C Tc = 125 C 8 A Value 200 16 Unit V A IFSM Tstg Tj 100 -65 to + 175 175 A C C Table 2. Symbol Rth(j-c) Thermal parameters Parameter TO-220AC, DPAK, Junction to case TO-220FPAC 5.5 D2PAK Value 3.2 C/W Unit Table 3. Symbol IR(1) VF(2) Static electrical characteristics Parameter Reverse leakage current Test conditions Tj = 25 C Tj = 125 C Forward voltage drop Tj = 25 C Tj = 150 C VR = VRRM Min. Typ Max. 6 A 6 0.95 IF = 8 A 0.8 60 1.05 V 0.90 Unit 1. Pulse test: tp = 5 ms, < 2 % 2. Pulse test: tp = 380 s, < 2 % To evaluate the conduction losses use the following equation: P = 0.73 x IF(AV) + 0.021 IF2(RMS) 2/11 STTH802 Table 4. Symbol Characteristics Dynamic characteristics Parameter Test conditions IF = 1 A, dIF/dt = -50 A/s, VR = 30 V, Tj = 25 C IF = 1 A, dIF/dt = -100 A/s, VR = 30 V, Tj = 25 C Reverse recovery current Forward recovery time Forward recovery voltage IF = 8 A, dIF/dt = -200 A/s, VR = 160 V, Tj = 125 C IF = 8 A, dIF/dt = 50 A/s VFR = 1.1 x VFmax, Tj = 25 C IF = 8 A, dIF/dt = 50 A/s, Tj = 25 C Min. Typ 25 17 5.5 150 1.5 Max. 30 22 7 A ns V Unit ns trr Reverse recovery time IRM tfr VFP Figure 1. IM(A) 100 Peak current versus duty cycle Figure 2. Forward voltage drop versus forward current (typical values) IFM(A) T IM 200 180 80 d=tp/T tp 160 140 60 P=5W 120 100 40 P=2W P=1W 80 60 40 Tj=150C Tj=25C 20 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 20 0 VFM(V) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 Figure 3. Forward voltage drop versus forward current (maximum values) Figure 4. Relative variation of thermal impedance, junction to case, versus pulse duration (TO-220AC, DPAK, D2PAK) IFM(A) 200 180 160 140 120 100 80 60 40 20 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Tj=25C Tj=150C Zth(j-c)/Rth(j-c) 1.0 Single pulse TO-220AC DPAK D2PAK VFM(V) 0.1 1.E-03 1.E-02 1.E-01 tp(s) 1.E+00 3/11 Characteristics STTH802 Figure 5. Relative variation of thermal impedance, junction to case, versus pulse duration (TO-220FPAC) Figure 6. Junction capacitanceversus reverse applied voltage (typical values) Zth(j-c)/Rth(j-c) 1.0 Single pulse TO-220FPAC C(pF) 100 F=1MHz Vosc=30mVRMS Tj=25C 0.1 tp(s) 0.0 1.E-03 VR(V) 10 1 10 100 1000 1.E-02 1.E-01 1.E+00 1.E+01 Figure 7. QRR(nC) 160 140 120 100 80 60 40 20 0 10 Reverse recovery charges versus dIF/dt (typical values) IF=8A VR=160V Figure 8. tRR(ns) 80 70 60 Reverse recovery time versus dIF/dt (typical values) IF=8A VR=160V Tj=125C 50 40 30 Tj=25C Tj=125C Tj=25C 20 10 dIF/dt(A/s) 0 dIF/dt(A/s) 100 1000 10 100 1000 Figure 9. Peak reverse recovery current versus dIF/dt (typical values) Figure 10. Dynamic parameters versus junction temperature QRR; IRM [T j] / Q RR; IRM [T j=125C] 1.4 IF=8A VR=160V IRM(A) 12 IF=8A VR=160V 10 1.2 1.0 8 0.8 IRM 6 Tj=125C 0.6 QRR 4 0.4 2 Tj=25C 0.2 dIF/dt(A/s) 0.0 Tj(C) 25 50 75 100 125 150 0 10 100 1000 4/11 STTH802 Ordering information scheme Figure 11. Thermal resistance, junction to ambient, versus copper surface under tab - Epoxy printed circuit board FR4, eCU = 35 m (D2PAK ) Rth(j-a) (C/W) 100 90 80 70 60 50 40 30 20 10 0 0 5 10 15 20 25 30 35 40 SCU(cm) D2PAK Figure 12. Thermal resistance, junction to ambient, versus copper surface under tab - Epoxy printed circuit board FR4, eCU = 35 m (DPAK) Rth(j-a) (C/W) 100 90 80 70 60 50 40 30 20 10 0 0 5 10 15 20 25 30 35 40 SCU(cm) DPAK 2 Ordering information scheme STTH Ultrafast switching diode Average forward current 8=8A Repetitive peak reverse voltage 02 = 200 V Package D = TO-220AC in Tube FP = TO-220FPAC in Tube B = DPAK in Tube B-TR = DPAK in Tape and reel G = D2PAK in Tube G-TR = D2PAK in Tape and reel 8 02 XXX 5/11 Package information STTH802 3 Package information Epoxy meets UL94, V0 Cooling method: by conduction (C) Recommended torque value: 0.8 Nm Maximum torque value: 1.0 Nm Table 5. T0-220AC dimensions DIMENSIONS REF. Millimeters Min. A H2 OI L5 L7 L6 L2 C A Inches Min. 0.173 0.048 0.094 0.019 0.024 0.044 0.194 0.393 Max. 0.181 0.051 0.107 0.027 0.034 0.066 0.202 0.409 Max. 4.60 1.32 2.72 0.70 0.88 1.70 5.15 10.40 4.40 1.23 2.40 0.49 0.61 1.14 4.95 10.00 C D E F F1 G F1 L9 L4 F D H2 L2 M E G 16.40 typ. 13.00 2.65 15.25 6.20 3.50 14.00 2.95 15.75 6.60 3.93 0.645 typ. 0.511 0.104 0.600 0.244 0.137 0.551 0.116 0.620 0.259 0.154 L4 L5 L6 L7 L9 M Diam. I 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 6/11 STTH802 Table 6. T0-220FPAC dimensions Package information DIMENSIONS REF Millimeters Min. A A H B Inches Min. 0.173 0.098 0.098 0.018 0.030 0.045 0.195 0.094 0.393 Max. 0.181 0.106 0.108 0.027 0.039 0.067 0.205 0.106 0.409 Max. 4.6 2.7 2.75 0.70 1 1.70 5.20 2.7 10.4 4.4 2.5 2.5 0.45 0.75 1.15 4.95 2.4 10 B D Dia L6 L2 L3 L5 F1 L4 D L7 E F F1 G G1 H L2 16 Typ. 28.6 9.8 2.9 15.9 9.00 3.00 30.6 10.6 3.6 16.4 9.30 3.20 0.63 Typ. 1.126 0.386 0.114 0.626 0.354 0.118 1.205 0.417 0.142 0.646 0.366 0.126 F G1 G E L3 L4 L5 L6 L7 Dia. 7/11 Package information Table 7. DPAK dimensions DIMENSIONS REF . E B2 L2 C2 A STTH802 Millimeters Min. Max 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 6.60 4.60 10.10 Inches Min. 0.086 0.035 0.001 0.025 0.204 0.017 0.018 0.236 0.251 0.173 0.368 Max. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.259 0.181 0.397 A A1 A2 B D 2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 6.40 4.40 9.35 B2 C C2 H L4 B G A1 R R C D E G A2 0.60 MIN. H L2 V2 0.80 typ. 0.60 0 1.00 8 0.031 typ. 0.023 0 0.039 8 L4 V2 Figure 13. DPAK footprint (dimensions in mm) 6.7 3 3 1.6 2.3 6.7 2.3 1.6 8/11 STTH802 Table 8. D2PAK dimensions Package information Dimensions Ref. Millimeters Min. A A E L2 C2 Inches Min. 0.173 0.098 0.001 0.027 0.045 0.017 0.048 0.352 0.393 0.192 0.590 0.050 0.055 0.094 Max. 0.181 0.106 0.009 0.037 0.067 0.024 0.054 0.368 0.409 0.208 0.624 0.055 0.069 0.126 Max. 4.60 2.69 0.23 0.93 1.70 0.60 1.36 9.35 10.40 5.28 15.85 1.40 1.75 3.20 4.40 2.49 0.03 0.70 1.14 0.45 1.23 8.95 10.00 4.88 15.00 1.27 1.40 2.40 A1 A2 B D L L3 A1 B2 B G A2 R B2 C C2 C D E G L M * V2 L2 L3 M R V2 * FLAT ZONE NO LESS THAN 2mm 0.40 typ. 0 8 0.016 typ. 0 8 Figure 14. D2PAK footprint (dimensions in mm) 16.90 10.30 1.30 5.08 8.90 3.70 In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 9/11 Ordering information STTH802 4 Ordering information Part Number STTH802D STTH802FP STTH802B STTH802B-TR STTH802G STTH802G-TR Marking STTH802 STTH802 STTH802 STTH802 STTH802 STTH802 Package TO-220AC TO-220FPAC DPAK DPAK D PAK D2 PAK 2 Weight 1.86 g 2.2 g 0.3 g 0.3 g 1.48 g 1.48 g Base qty 50 50 75 2500 50 1000 Delivery mode Tube Tube Tube Tape and reel Tube Tape and reel 5 Revision history Date 03-May-2006 22-Sep-2006 Revision 1 2 First issue Added D2PAK package Description of Changes 10/11 STTH802 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 11/11 |
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